1N976C vs JAN1N978BUR-1 feature comparison

1N976C International Semiconductor Inc

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JAN1N978BUR-1 Microsemi Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTERNATIONAL SEMICONDUCTOR INC MICROSEMI CORP
Package Description O-LALF-W2 HERMETIC SEALED, GLASS, LL34, MELF-2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 93 Ω
JEDEC-95 Code DO-35 DO-213AA
JESD-30 Code O-LALF-W2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 43 V 51 V
Surface Mount NO YES
Technology ZENER ZENER
Terminal Form WIRE WRAP AROUND
Terminal Position AXIAL END
Voltage Tol-Max 2% 5%
Working Test Current 3 mA 2.5 mA
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Samacsys Manufacturer Microsemi Corporation
Additional Feature METALLURGICALLY BONDED
JESD-609 Code e0
Moisture Sensitivity Level 1
Reference Standard MIL-19500/117
Terminal Finish TIN LEAD

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