1N975BTR
vs
1N975A-1E3/TR
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DO-7
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-609 Code |
e0
|
e3
|
| Number of Elements |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.48 W
|
0.417 W
|
| Reference Voltage-Nom |
39 V
|
39 V
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Voltage Tol-Max |
5%
|
10%
|
| Working Test Current |
3.2 mA
|
3.2 mA
|
| Base Number Matches |
3
|
2
|
| Package Description |
|
DO-7, 2 PIN
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Dynamic Impedance-Max |
|
80 Ω
|
| Forward Voltage-Max (VF) |
|
1.1 V
|
| JEDEC-95 Code |
|
DO-204AA
|
| JESD-30 Code |
|
O-LALF-W2
|
| Knee Impedance-Max |
|
1000 Ω
|
| Number of Terminals |
|
2
|
| Package Body Material |
|
GLASS
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Qualification Status |
|
Not Qualified
|
| Reverse Current-Max |
|
5 µA
|
| Reverse Test Voltage |
|
29.7 V
|
| Surface Mount |
|
NO
|
| Terminal Form |
|
WIRE
|
| Terminal Position |
|
AXIAL
|
| Voltage Temp Coeff-Max |
|
36.66 mV/°C
|
|
|
|
Compare 1N975BTR with alternatives
Compare 1N975A-1E3/TR with alternatives