1N973B-PBF
vs
1N973B-1
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
DIGITRON SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
58 Ω
|
58 Ω
|
| Forward Voltage-Max (VF) |
1.1 V
|
|
| JEDEC-95 Code |
DO-35
|
DO-204AH
|
| JESD-30 Code |
O-XALF-W2
|
O-LALF-W2
|
| Knee Impedance-Max |
1000 Ω
|
1000 Ω
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.4 W
|
| Reference Voltage-Nom |
33 V
|
33 V
|
| Reverse Current-Max |
5 µA
|
0.5 µA
|
| Reverse Test Voltage |
25.1 V
|
25 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Voltage Temp Coeff-Max |
30.36 mV/°C
|
30.36 mV/°C
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
3.8 mA
|
3.8 mA
|
| Base Number Matches |
1
|
8
|
| Package Description |
|
DO-35, 2 PIN
|
| Factory Lead Time |
|
14 Weeks
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| JESD-609 Code |
|
e0
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 1N973B-PBF with alternatives
Compare 1N973B-1 with alternatives