1N973-1E3/TR
vs
1N973-1E3TR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
DO-7, 2 PIN
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
58 Ω
|
58 Ω
|
| Forward Voltage-Max (VF) |
1.1 V
|
|
| JEDEC-95 Code |
DO-204AA
|
DO-204AA
|
| JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
| JESD-609 Code |
e3
|
e3
|
| Knee Impedance-Max |
1000 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
0.417 W
|
0.5 W
|
| Reference Voltage-Nom |
33 V
|
33 V
|
| Reverse Current-Max |
5 µA
|
|
| Reverse Test Voltage |
25.1 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Voltage Temp Coeff-Max |
30.36 mV/°C
|
|
| Voltage Tol-Max |
20%
|
20%
|
| Working Test Current |
3.8 mA
|
3.8 mA
|
| Base Number Matches |
1
|
6
|
| Part Package Code |
|
DO-7
|
| Pin Count |
|
2
|
|
|
|
Compare 1N973-1E3/TR with alternatives
Compare 1N973-1E3TR with alternatives