1N973-1E3/TR
vs
1N972BTR
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
CENTRAL SEMICONDUCTOR CORP
|
Package Description |
DO-7, 2 PIN
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Additional Feature |
METALLURGICALLY BONDED
|
INDUSTRY STANDARD
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
58 Ω
|
|
Forward Voltage-Max (VF) |
1.1 V
|
|
JEDEC-95 Code |
DO-204AA
|
DO-35
|
JESD-30 Code |
O-LALF-W2
|
O-PALF-W2
|
JESD-609 Code |
e3
|
e0
|
Knee Impedance-Max |
1000 Ω
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.417 W
|
0.5 W
|
Reference Voltage-Nom |
33 V
|
30 V
|
Reverse Current-Max |
5 µA
|
|
Reverse Test Voltage |
25.1 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Voltage Temp Coeff-Max |
30.36 mV/°C
|
|
Voltage Tol-Max |
20%
|
|
Working Test Current |
3.8 mA
|
|
Base Number Matches |
1
|
4
|
Pbfree Code |
|
No
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Qualification Status |
|
Not Qualified
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 1N973-1E3/TR with alternatives
Compare 1N972BTR with alternatives