1N971BTR
vs
1N971B(DO7)
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
41 Ω
JEDEC-95 Code
DO-204AH
DO-7
JESD-30 Code
O-LALF-W2
O-XALF-W2
JESD-609 Code
e0
e0
Knee Impedance-Max
750 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.4 W
Reference Standard
MIL-STD-750
Reference Voltage-Nom
27 V
27 V
Reverse Current-Max
5 µA
Reverse Test Voltage
20.6 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
24.3 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
4.6 mA
4.6 mA
Base Number Matches
1
1
Part Package Code
DO-7
Package Description
O-XALF-W2
Pin Count
2
Qualification Status
Not Qualified
Compare 1N971BTR with alternatives
Compare 1N971B(DO7) with alternatives