1N971BE3
vs
JAN1N971B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
M/A-COM TECHNOLOGY SOLUTIONS INC
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-7, 2 PIN
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
compliant
compliant
Factory Lead Time
14 Weeks
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AA
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.417 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
27 V
27 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
4.6 mA
4.6 mA
Base Number Matches
2
6
ECCN Code
EAR99
HTS Code
8541.10.00.50
Reference Standard
MIL-19500/117
Compare 1N971BE3 with alternatives
Compare JAN1N971B with alternatives