1N971B
vs
1N971B
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICRO COMMERCIAL COMPONENTS CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-35
Package Description
GLASS PACKAGE-2
HERMETIC SEALED, GLASS, DO-7, 2 PIN
Pin Count
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
41 Ω
JEDEC-95 Code
DO-35
DO-204AA
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Knee Impedance-Max
750 Ω
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.417 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
27 V
27 V
Reverse Current-Max
0.005 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
4.6 mA
4.6 mA
Base Number Matches
10
14
Factory Lead Time
14 Weeks
Additional Feature
METALLURGICALLY BONDED
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Compare 1N971B with alternatives
Compare 1N971B with alternatives