1N970A vs 1N970B feature comparison

1N970A Cobham Semiconductor Solutions

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1N970B Microchip Technology Inc

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Part Life Cycle Code Transferred Active
Ihs Manufacturer AEROFLEX/METELICS INC MICROCHIP TECHNOLOGY INC
Part Package Code DO-35
Package Description HERMETIC SEALED, GLASS PACKAGE-2 HERMETIC SEALED, GLASS, DO-7, 2 PIN
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-35 DO-204AA
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.417 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 24 V 24 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 10% 5%
Working Test Current 5.2 mA 5.2 mA
Base Number Matches 8 18
Rohs Code No
Factory Lead Time 14 Weeks
Additional Feature METALLURGICALLY BONDED

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