1N967BRL
vs
CD967B
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
MICROSEMI CORP
Package Description
O-LALF-W2
DIE-2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
CATHODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AH
JESD-30 Code
O-LALF-W2
S-XUUC-N1
JESD-609 Code
e0
e0
Knee Impedance-Max
750 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
SQUARE
Package Style
LONG FORM
UNCASED CHIP
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
18 V
18 V
Reverse Current-Max
5 µA
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
NO LEAD
Terminal Position
AXIAL
UNSPECIFIED
Voltage Tol-Max
5%
5%
Working Test Current
7 mA
7 mA
Base Number Matches
2
2
Pbfree Code
No
Part Package Code
DIE
Pin Count
2
Compare 1N967BRL with alternatives
Compare CD967B with alternatives