1N966BHJ vs 1N967-1 feature comparison

1N966BHJ ROHM Semiconductor

Buy Now Datasheet

1N967-1 Microsemi Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ROHM CO LTD MICROSEMI CORP
Package Description O-LALF-W2 HERMETICALLY SEALED, GLASS PACKAGE-2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LALF-W2 O-LALF-W2
Knee Impedance-Max 700 Ω
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reverse Current-Max 5 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Working Test Current 7.8 mA 7 mA
Base Number Matches 1 22
Pbfree Code No
Rohs Code No
Part Package Code DO-7
Pin Count 2
Dynamic Impedance-Max 21 Ω
JEDEC-95 Code DO-35
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 175 °C
Reference Voltage-Nom 18 V
Terminal Finish TIN LEAD
Voltage Tol-Max 20%

Compare 1N966BHJ with alternatives

Compare 1N967-1 with alternatives