1N944BE3
vs
JAN1N944B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS, DO-7
O-LALF-W2
Reach Compliance Code
compliant
not_compliant
Factory Lead Time
26 Weeks
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AA
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Reference Voltage-Nom
11.7 V
11.7 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
0.117 mV/°C
0.117 mV/°C
Voltage Tol-Max
5%
4.96%
Base Number Matches
2
4
Pbfree Code
Part Package Code
DO-7
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
30 Ω
JESD-609 Code
e0
Operating Temperature-Max
150 °C
Operating Temperature-Min
-65 °C
Qualification Status
Not Qualified
Reference Standard
MIL-19500/157P
Terminal Finish
TIN LEAD
Working Test Current
7.5 mA
Compare 1N944BE3 with alternatives
Compare JAN1N944B with alternatives