1N944BE3
vs
JAN1N944B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MOTOROLA INC
Package Description
HERMETIC SEALED, GLASS, DO-7
O-LALF-W2
Reach Compliance Code
compliant
unknown
Factory Lead Time
26 Weeks
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AA
DO-204AA
JESD-30 Code
O-LALF-W2
O-LALF-W2
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Reference Voltage-Nom
11.7 V
11.7 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
0.117 mV/°C
0.117 mV/°C
Voltage Tol-Max
5%
5%
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8541.10.00.50
Operating Temperature-Max
175 °C
Operating Temperature-Min
-55 °C
Qualification Status
Not Qualified
Reference Standard
MIL-19500/157
Working Test Current
7.5 mA
Compare 1N944BE3 with alternatives
Compare JAN1N944B with alternatives