1N944
vs
CH941B-VIAL
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
HERMETIC SEALED, GLASS, DO-7
|
X-XUUC-N
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
26 Weeks
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-204AA
|
|
| JESD-30 Code |
O-LALF-W2
|
X-XUUC-N
|
| JESD-609 Code |
e0
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
GLASS
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
UNSPECIFIED
|
| Package Style |
LONG FORM
|
UNCASED CHIP
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
11.7 V
|
11.7 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WIRE
|
NO LEAD
|
| Terminal Position |
AXIAL
|
UPPER
|
| Voltage Temp Coeff-Max |
0.117 mV/°C
|
1.17 mV/°C
|
| Voltage Tol-Max |
5%
|
5%
|
| Base Number Matches |
15
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Working Test Current |
|
7.5 mA
|
|
|
|
Compare 1N944 with alternatives
Compare CH941B-VIAL with alternatives