1N944
vs
CH941-WAFFLE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS, DO-7
X-XUUC-N
Reach Compliance Code
compliant
unknown
Factory Lead Time
26 Weeks
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AA
JESD-30 Code
O-LALF-W2
X-XUUC-N
JESD-609 Code
e0
e0
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
UNSPECIFIED
Package Style
LONG FORM
UNCASED CHIP
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
11.7 V
11.7 V
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
NO LEAD
Terminal Position
AXIAL
UPPER
Voltage Temp Coeff-Max
0.117 mV/°C
1.17 mV/°C
Voltage Tol-Max
5%
5%
Base Number Matches
15
1
ECCN Code
EAR99
HTS Code
8541.10.00.50
Polarity
UNIDIRECTIONAL
Working Test Current
7.5 mA
Compare 1N944 with alternatives
Compare CH941-WAFFLE with alternatives