1N935B
vs
JANTXV1N935B-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MOTOROLA INC
MICROCHIP TECHNOLOGY INC
Package Description
O-LALF-W2
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
20 Ω
JEDEC-95 Code
DO-204AA
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-55 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
9 V
9 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
0.9 mV/°C
0.9 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
7.5 mA
Base Number Matches
16
4
Additional Feature
METALLURGICALLY BONDED
Reference Standard
MIL-19500
Compare 1N935B with alternatives
Compare JANTXV1N935B-1 with alternatives