1N827UR-1/TR
vs
CDLL827E3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
HERMETIC SEALED, GLASS, MELF-2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
TR, 7 INCH; 2000
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
15 Ω
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Reference Voltage-Nom
6.2 V
6.2 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Temp Coeff-Max
0.062 mV/°C
0.062 mV/°C
Voltage Tol-Max
4.84%
4.84%
Working Test Current
7.5 mA
Base Number Matches
1
2
Compare 1N827UR-1/TR with alternatives
Compare CDLL827E3 with alternatives