1N827A136
vs
1N827
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
AEROFLEX MICROELECTRONIC SOLUTIONS
|
| Package Description |
O-LALF-W2
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
|
| JEDEC-95 Code |
DO-34
|
|
| JESD-30 Code |
O-LALF-W2
|
|
| Number of Elements |
1
|
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
200 °C
|
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Power Dissipation-Max |
0.4 W
|
|
| Qualification Status |
Not Qualified
|
|
| Reference Voltage-Nom |
6.2 V
|
|
| Surface Mount |
NO
|
|
| Technology |
ZENER
|
|
| Terminal Form |
WIRE
|
|
| Terminal Position |
AXIAL
|
|
| Voltage Temp Coeff-Max |
0.062 mV/°C
|
|
| Working Test Current |
7.5 mA
|
|
| Base Number Matches |
1
|
26
|
|
|
|
Compare 1N827A136 with alternatives