1N827-1E3
vs
1N827RL
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
MOTOROLA INC
|
Part Package Code |
DO-35
|
|
Package Description |
DO-35, 2 PIN
|
O-LALF-W2
|
Pin Count |
2
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Samacsys Manufacturer |
Microsemi Corporation
|
|
Additional Feature |
METALLURGICALLY BONDED
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
15 Ω
|
|
JEDEC-95 Code |
DO-204AH
|
|
JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
JESD-609 Code |
e3
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Power Dissipation-Max |
0.5 W
|
0.4 W
|
Reference Standard |
MIL-19500
|
|
Reference Voltage-Nom |
6.2 V
|
6.2 V
|
Reverse Current-Max |
2 µA
|
|
Reverse Test Voltage |
3 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Voltage Temp Coeff-Max |
0.062 mV/°C
|
0.062 mV/°C
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
7.5 mA
|
7.5 mA
|
Base Number Matches |
2
|
2
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare 1N827-1E3 with alternatives
Compare 1N827RL with alternatives