1N826TR vs 1N825AV feature comparison

1N826TR Microsemi Corporation

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1N825AV STMicroelectronics

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP STMICROELECTRONICS
Part Package Code DO-7
Package Description O-LALF-W2 O-LALF-W2
Pin Count 2
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED TEMPERATURE COMPENSATED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AA
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Power Dissipation-Max 0.5 W 0.4 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 6.55 V 6.2 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 0.131 mV/°C 0.124 mV/°C
Voltage Tol-Max 5.34%
Base Number Matches 1 1
Operating Temperature-Max 175 °C
Operating Temperature-Min -55 °C
Working Test Current 7.5 mA

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