1N825AE3
vs
1N825A-1E3/TR
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED, GLASS, DO-7, 2 PIN
HERMETIC SEALED, GLASS, DO-7, 2 PIN
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AA
DO-204AA
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e3
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Reference Voltage-Nom
6.2 V
6.2 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN
TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
0.124 mV/°C
0.124 mV/°C
Voltage Tol-Max
4.84%
4.84%
Base Number Matches
2
1
Factory Lead Time
26 Weeks
Samacsys Manufacturer
Microchip
Compare 1N825AE3 with alternatives
Compare 1N825A-1E3/TR with alternatives