1N825136
vs
1N825-1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
AEROFLEX/METELICS INC
Package Description
O-LALF-W2
HERMETIC SEALED PACKAGE-2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-34
DO-35
JESD-30 Code
O-LALF-W2
O-XALF-W2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.4 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
6.2 V
6.2 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
0.124 mV/°C
0.124 mV/°C
Working Test Current
7.5 mA
Base Number Matches
1
8
Part Package Code
DO-35
Pin Count
2
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Voltage Tol-Max
4.84%
Compare 1N825136 with alternatives
Compare 1N825-1 with alternatives