1N825-1
vs
1N826
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DO-7
DO-7
Package Description
DO-35, 2 PIN
HERMETIC SEALED, GLASS, DO-35, 2 PIN
Pin Count
2
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Samacsys Manufacturer
Microsemi Corporation
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
15 Ω
JEDEC-95 Code
DO-204AH
DO-204AH
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-55 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.475 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500
Reference Voltage-Nom
6.2 V
6.55 V
Reverse Current-Max
2 µA
Reverse Test Voltage
3 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
0.124 mV/°C
0.131 mV/°C
Voltage Tol-Max
5%
5.34%
Working Test Current
7.5 mA
Base Number Matches
17
61
Moisture Sensitivity Level
1
Compare 1N825-1 with alternatives
Compare 1N826 with alternatives