1N821A153 vs 1N821 feature comparison

1N821A153 NXP Semiconductors

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1N821 Microsemi Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MICROSEMI CORP
Package Description O-LALF-W2 DIE-3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-34 DO-204AH
JESD-30 Code O-LALF-W2 S-XXSS-N3
Number of Elements 1 1
Number of Terminals 2 3
Operating Temperature-Max 200 °C 175 °C
Package Body Material GLASS UNSPECIFIED
Package Shape ROUND SQUARE
Package Style LONG FORM SPECIAL SHAPE
Power Dissipation-Max 0.4 W 0.475 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 6.2 V 6.2 V
Surface Mount NO YES
Technology ZENER ZENER
Terminal Form WIRE NO LEAD
Terminal Position AXIAL UNSPECIFIED
Voltage Temp Coeff-Max 0.62 mV/°C 0.62 mV/°C
Working Test Current 7.5 mA
Base Number Matches 1 150
Pbfree Code No
Rohs Code No
Part Package Code DO-7
Pin Count 2
Samacsys Manufacturer Microsemi Corporation
Additional Feature METALLURGICALLY BONDED
JESD-609 Code e0
Operating Temperature-Min -65 °C
Terminal Finish TIN LEAD
Voltage Tol-Max 4.84%

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