1N821A-1
vs
JANKCA1N821
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
DO-35, 2 PIN
HERMETIC SEALED, DIE-3
Reach Compliance Code
compliant
compliant
Factory Lead Time
26 Weeks
Category CO2 Kg
8.7
8.7
Compliance Temperature Grade
Military: -55C to +175C
Candidate List Date
2020-06-25
2018-06-27
Conflict Mineral Status
DRC Conflict Free
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.10
CMRT V5.10
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
10 Ω
15 Ω
JEDEC-95 Code
DO-204AH
JESD-30 Code
O-LALF-W2
S-XUUC-N3
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
3
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-55 °C
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
SQUARE
Package Style
LONG FORM
UNCASED CHIP
Power Dissipation-Max
0.5 W
0.5 W
Reference Standard
MIL-19500
MIL-19500/159M
Reference Voltage-Nom
6.2 V
6.2 V
Reverse Current-Max
2 µA
Reverse Test Voltage
3 V
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
WIRE
NO LEAD
Terminal Position
AXIAL
UPPER
Voltage Temp Coeff-Max
0.62 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
7.5 mA
7.5 mA
Base Number Matches
7
4
Part Package Code
DIE
Pin Count
3
ECCN Code
EAR99
HTS Code
8541.10.00.50
kg CO2e/kg
8.7
Average Weight (mg)
1.1
CO2e (mg)
9.57
Qualifications
Rad Hard
Qualification Status
Not Qualified
Compare 1N821A-1 with alternatives
Compare JANKCA1N821 with alternatives