1N821
vs
JANHCA1N821
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-7
Package Description
DIE-3
HERMETIC SEALED, DIE-3
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Samacsys Manufacturer
Microsemi Corporation
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AH
JESD-30 Code
S-XXSS-N3
S-XUUC-N3
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
SQUARE
SQUARE
Package Style
SPECIAL SHAPE
UNCASED CHIP
Power Dissipation-Max
0.475 W
0.5 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
6.2 V
6.2 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UNSPECIFIED
UPPER
Voltage Temp Coeff-Max
0.62 mV/°C
Voltage Tol-Max
4.84%
5%
Base Number Matches
150
1
Dynamic Impedance-Max
15 Ω
Reference Standard
MIL-19500/159M
Working Test Current
7.5 mA
Compare 1N821 with alternatives
Compare JANHCA1N821 with alternatives