1N821 vs 1N821136 feature comparison

1N821 Microsemi Corporation

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1N821136 NXP Semiconductors

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP NXP SEMICONDUCTORS
Part Package Code DO-7
Package Description DIE-3 O-LALF-W2
Pin Count 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Samacsys Manufacturer Microsemi Corporation
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AH DO-34
JESD-30 Code S-XXSS-N3 O-LALF-W2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 3 2
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -65 °C
Package Body Material UNSPECIFIED GLASS
Package Shape SQUARE ROUND
Package Style SPECIAL SHAPE LONG FORM
Power Dissipation-Max 0.475 W 0.4 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 6.2 V 6.2 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form NO LEAD WIRE
Terminal Position UNSPECIFIED AXIAL
Voltage Temp Coeff-Max 0.62 mV/°C 0.62 mV/°C
Voltage Tol-Max 4.84%
Base Number Matches 150 1
Working Test Current 7.5 mA

Compare 1N821 with alternatives

Compare 1N821136 with alternatives