1N8158US
vs
MX1N8158
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
MELF-2
Reach Compliance Code
compliant
compliant
Factory Lead Time
21 Weeks
Additional Feature
HIGH RELIABILITY
HIGH RELIABILITY
Breakdown Voltage-Min
19 V
19 V
Case Connection
ISOLATED
ISOLATED
Clamping Voltage-Max
27.7 V
27.7 V
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
TRANS VOLTAGE SUPPRESSOR DIODE
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code
O-LELF-R2
O-LALF-W2
Non-rep Peak Rev Power Dis-Max
150 W
150 W
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Reference Standard
IEC-61000-4-2, 4-4
IEC-61000-4-2,4-4,4-5
Rep Pk Reverse Voltage-Max
17 V
17 V
Surface Mount
YES
NO
Technology
AVALANCHE
AVALANCHE
Terminal Form
WRAP AROUND
WIRE
Terminal Position
END
AXIAL
Base Number Matches
2
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Reverse Current-Max
0.5 µA
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