1N759
vs
1N759-B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICRO COMMERCIAL COMPONENTS
Part Package Code
DO-7
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Samacsys Manufacturer
Microsemi Corporation
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
Diode Element Material
SILICON
Diode Type
ZENER DIODE
Dynamic Impedance-Max
30 Ω
JEDEC-95 Code
DO-35
JESD-30 Code
O-LALF-W2
JESD-609 Code
e0
e0
Moisture Sensitivity Level
1
Number of Elements
1
Number of Terminals
2
Operating Temperature-Max
175 °C
Package Body Material
GLASS
Package Shape
ROUND
Package Style
LONG FORM
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
Qualification Status
Not Qualified
Reference Voltage-Nom
12 V
Surface Mount
NO
Technology
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
Terminal Position
AXIAL
Voltage Tol-Max
10%
Working Test Current
20 mA
Base Number Matches
33
1
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
30
Compare 1N759 with alternatives
Compare 1N759-B with alternatives