1N6643USE3
vs
JANS1N6643US
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
COBHAM PLC
|
Part Package Code |
MELF
|
|
Package Description |
ROHS COMPLIANT, HERMETIC SEALED, GLASS, D-5B, SQ-MELF, B PACKAGE-2
|
SURFACEMOUNT PACKAGE-2
|
Pin Count |
2
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.70
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
O-LELF-R2
|
O-XELF-R2
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Output Current-Max |
0.3 A
|
0.3 A
|
Package Body Material |
GLASS
|
UNSPECIFIED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Rep Pk Reverse Voltage-Max |
50 V
|
|
Reverse Recovery Time-Max |
0.006 µs
|
0.006 µs
|
Surface Mount |
YES
|
YES
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Base Number Matches |
1
|
11
|
Additional Feature |
|
METALLURGICALLY BONDED
|
Qualification Status |
|
Not Qualified
|
Reference Standard |
|
MIL-19500/578E
|
|
|
|
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