1N6642US
vs
1N6642USE3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS, D-5D, 2 PIN
ROHS COMPLIANT, HERMETIC SEALED, GLASS, D-5B, SQ-MELF, B PACKAGE-2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.70
8541.10.00.70
Samacsys Manufacturer
Microsemi Corporation
Microsemi Corporation
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Output Current-Max
0.3 A
0.3 A
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Not Qualified
Rep Pk Reverse Voltage-Max
75 V
75 V
Reverse Recovery Time-Max
0.005 µs
0.005 µs
Surface Mount
YES
YES
Terminal Finish
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
10
2
Part Package Code
MELF
Pin Count
2
Application
GENERAL PURPOSE
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Compare 1N6642US with alternatives
Compare 1N6642USE3 with alternatives