1N6631
vs
JANTX1N6631
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED, GLASS, E, 2 PIN
HERMETIC SEALED, GLASS, E, 2 PIN
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.80
Additional Feature
METALLURGICALLY BONDED, HIGH RELIABILITY
METALLURGICALLY BONDED, HIGH RELIABILITY
Application
ULTRA FAST RECOVERY
ULTRA FAST RECOVERY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Non-rep Pk Forward Current-Max
60 A
60 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Output Current-Max
1.4 A
1.4 A
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Not Qualified
Qualified
Reverse Recovery Time-Max
0.08 µs
0.08 µs
Surface Mount
NO
NO
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
14
4
Reference Standard
MIL-19500/590
Compare 1N6631 with alternatives
Compare JANTX1N6631 with alternatives