1N6627US
vs
JANTXV1N6627US
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Package Description |
GLASS, D-5B PACKAGE, 2 PIN
|
GLASS, D-5B PACKAGE, 2 PIN
|
Pin Count |
2
|
2
|
Manufacturer Package Code |
D-5B PACKAGE
|
D-5B PACKAGE
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
Application |
HIGH VOLTAGE ULTRA FAST RECOVERY
|
ULTRA FAST RECOVERY POWER
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
JESD-609 Code |
e0
|
e0
|
Non-rep Pk Forward Current-Max |
75 A
|
75 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Output Current-Max |
4 A
|
4 A
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
400 V
|
400 V
|
Reverse Recovery Time-Max |
0.03 µs
|
0.03 µs
|
Surface Mount |
YES
|
YES
|
Technology |
AVALANCHE
|
AVALANCHE
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Base Number Matches |
5
|
1
|
Reference Standard |
|
MIL-19500/590F
|
|
|
|
Compare 1N6627US with alternatives
Compare JANTXV1N6627US with alternatives