1N6485US vs MQ3EZ68D5 feature comparison

1N6485US Microsemi Corporation

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MQ3EZ68D5 Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS PACKAGE-2 O-PALF-W2
Reach Compliance Code unknown unknown
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-PALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.25 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3.3 V 68 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 76 mA 11 mA
Base Number Matches 3 1
Part Package Code DO-41
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
JEDEC-95 Code DO-204AL
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C

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