1N648-1E3
vs
BYM11-400-E3/96
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
VISHAY INTERTECHNOLOGY INC
|
Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.70
|
|
Additional Feature |
METALLURGICALLY BONDED
|
FREE WHEELING DIODE
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JEDEC-95 Code |
DO-35
|
DO-213AB
|
JESD-30 Code |
O-LALF-W2
|
O-PELF-R2
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Output Current-Max |
0.4 A
|
1 A
|
Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Power Dissipation-Max |
0.5 W
|
|
Surface Mount |
NO
|
YES
|
Terminal Form |
WIRE
|
WRAP AROUND
|
Terminal Position |
AXIAL
|
END
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
Factory Lead Time |
|
8 Weeks
|
Samacsys Manufacturer |
|
Vishay
|
Forward Voltage-Max (VF) |
|
1.3 V
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Non-rep Pk Forward Current-Max |
|
30 A
|
Operating Temperature-Max |
|
175 °C
|
Operating Temperature-Min |
|
-65 °C
|
Peak Reflow Temperature (Cel) |
|
250
|
Qualification Status |
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
|
400 V
|
Reverse Recovery Time-Max |
|
0.15 µs
|
Terminal Finish |
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare 1N648-1E3 with alternatives
Compare BYM11-400-E3/96 with alternatives