1N645-1E3
vs
JANTXV1N645-1/TR
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.70
|
|
Samacsys Manufacturer |
Microsemi Corporation
|
|
Additional Feature |
METALLURGICALLY BONDED
|
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JEDEC-95 Code |
DO-35
|
DO-35
|
JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Output Current-Max |
0.4 A
|
0.4 A
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Surface Mount |
NO
|
NO
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
Forward Voltage-Max (VF) |
|
1 V
|
Non-rep Pk Forward Current-Max |
|
5 A
|
Operating Temperature-Max |
|
175 °C
|
Operating Temperature-Min |
|
-65 °C
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Reference Standard |
|
MIL-PRF-19500
|
Rep Pk Reverse Voltage-Max |
|
225 V
|
Reverse Current-Max |
|
0.05 µA
|
Reverse Test Voltage |
|
225 V
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 1N645-1E3 with alternatives
Compare JANTXV1N645-1/TR with alternatives