1N6328US
vs
1N6328US
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED, GLASS, B, D-5D, 2 PIN
HERMETIC SEALED, GLASS, B, D-5D, 2 PIN
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Samacsys Manufacturer
Microsemi Corporation
Microchip
Additional Feature
METALLURGICALLY BONDED, HIGH RELIABILITY
METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
10 Ω
10 Ω
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
15 V
15 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
5%
5%
Working Test Current
8.5 mA
8.5 mA
Base Number Matches
6
7
Factory Lead Time
28 Weeks
Compare 1N6328US with alternatives
Compare 1N6328US with alternatives