1N6314USE3
vs
JAN1N6314US
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
O-LELF-R2
MELF-2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
HIGH RELIABILITY, METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
23 Ω
23 Ω
JESD-30 Code
O-LELF-R2
O-LELF-R2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Reference Voltage-Nom
3.9 V
3.9 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
PURE MATTE TIN
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
5%
5%
Working Test Current
20 mA
20 mA
Base Number Matches
1
5
Pin Count
2
JESD-609 Code
e0
Knee Impedance-Max
1700 Ω
Qualification Status
Not Qualified
Reference Standard
MIL-19500
Reverse Current-Max
2 µA
Reverse Test Voltage
1 V
Compare 1N6314USE3 with alternatives
Compare JAN1N6314US with alternatives