1N6146USE3
vs
JANTXV1N6146US
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
SEMTECH CORP
|
| Package Description |
O-LELF-R2
|
HERMETIC SEALED, SURFACE MOUNT PACKAGE-2
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Breakdown Voltage-Min |
13.54 V
|
13.5 V
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JESD-30 Code |
O-LELF-R2
|
O-XELF-N2
|
| JESD-609 Code |
e3
|
|
| Non-rep Peak Rev Power Dis-Max |
1500 W
|
1500 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
GLASS
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
BIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
3 W
|
7.5 W
|
| Reference Standard |
IEC-61000-4-2, 4-4, 4-5
|
MIL-19500/516
|
| Rep Pk Reverse Voltage-Max |
11.4 V
|
11.4 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
AVALANCHE
|
ZENER
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
WRAP AROUND
|
NO LEAD
|
| Terminal Position |
END
|
END
|
| Base Number Matches |
1
|
1
|
| Pin Count |
|
2
|
| Clamping Voltage-Max |
|
21.9 V
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Qualified
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 1N6146USE3 with alternatives
Compare JANTXV1N6146US with alternatives