1N6139 vs 1N6139E3 feature comparison

1N6139 Semtech Corporation

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1N6139E3 Microsemi Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SEMTECH CORP MICROSEMI CORP
Package Description HERMETIC SEALED PACKAGE-2 O-LALF-W2
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature LOW IMPEDANCE HIGH RELIABILITY
Breakdown Voltage-Min 6.75 V
Breakdown Voltage-Nom 7.5 V
Case Connection ISOLATED ISOLATED
Clamping Voltage-Max 11.8 V
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code O-XALF-W2 O-LALF-W2
Non-rep Peak Rev Power Dis-Max 1500 W 1500 W
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL BIDIRECTIONAL
Power Dissipation-Max 7.5 W 3 W
Qualification Status Not Qualified
Rep Pk Reverse Voltage-Max 5.7 V 5.7 V
Surface Mount NO NO
Technology ZENER AVALANCHE
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Base Number Matches 12 1
Rohs Code Yes
JESD-609 Code e3
Operating Temperature-Max 175 °C
Operating Temperature-Min -55 °C
Terminal Finish MATTE TIN

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Compare 1N6139E3 with alternatives