1N6127
vs
1N6127
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
SEMICON COMPONENTS INC
|
| Package Description |
HERMETIC SEALED, GLASS, E PACKAGE-2
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
21 Weeks
|
|
| Additional Feature |
HIGH RELIABILITY
|
|
| Breakdown Voltage-Min |
71.3 V
|
|
| Breakdown Voltage-Nom |
75 V
|
75 V
|
| Case Connection |
ISOLATED
|
|
| Clamping Voltage-Max |
108 V
|
108 V
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JESD-30 Code |
O-LALF-W2
|
|
| JESD-609 Code |
e0
|
e0
|
| Non-rep Peak Rev Power Dis-Max |
500 W
|
|
| Number of Elements |
1
|
|
| Number of Terminals |
2
|
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Polarity |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Power Dissipation-Max |
2 W
|
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
56 V
|
56 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
AVALANCHE
|
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
WIRE
|
|
| Terminal Position |
AXIAL
|
|
| Base Number Matches |
22
|
8
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
|
|
|
Compare 1N6127 with alternatives
Compare 1N6127 with alternatives