1N6119US
vs
JAN1N6119US
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
SENSITRON SEMICONDUCTOR
MICROCHIP TECHNOLOGY INC
Part Package Code
MELF
Package Description
HERMETIC SEALED, GLASS, MELF-2
MELF-2
Pin Count
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
HIGH RELIABILITY
Breakdown Voltage-Min
34.2 V
34.2 V
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
TRANS VOLTAGE SUPPRESSOR DIODE
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
Non-rep Peak Rev Power Dis-Max
500 W
500 W
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity
UNIDIRECTIONAL
BIDIRECTIONAL
Power Dissipation-Max
2 W
2 W
Qualification Status
Not Qualified
Qualified
Rep Pk Reverse Voltage-Max
27.4 V
27.4 V
Surface Mount
YES
YES
Technology
AVALANCHE
AVALANCHE
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
7
1
Clamping Voltage-Max
52.4 V
JESD-609 Code
e0
Operating Temperature-Max
175 °C
Operating Temperature-Min
-55 °C
Reference Standard
MIL-19500
Reverse Current-Max
1 µA
Reverse Test Voltage
27.4 V
Terminal Finish
TIN LEAD
Compare 1N6119US with alternatives
Compare JAN1N6119US with alternatives