1N6114AUS
vs
1N6114AUSE3
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
SEMTECH CORP
|
MICROSEMI CORP
|
Package Description |
HERMETIC SEALED, SURFACE MOUNT PACKAGE-2
|
|
Pin Count |
2
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Factory Lead Time |
24 Weeks
|
|
Samacsys Manufacturer |
SEMTECH
|
|
Additional Feature |
METALLURGICALLY BONDED
|
|
Breakdown Voltage-Min |
20.9 V
|
|
Breakdown Voltage-Nom |
20.9 V
|
20.9 V
|
Case Connection |
ISOLATED
|
|
Clamping Voltage-Max |
30.5 V
|
30.5 V
|
Configuration |
SINGLE
|
|
Diode Element Material |
SILICON
|
|
Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
JESD-30 Code |
O-XELF-N2
|
|
JESD-609 Code |
e0
|
|
Non-rep Peak Rev Power Dis-Max |
500 W
|
|
Number of Elements |
1
|
|
Number of Terminals |
2
|
|
Package Body Material |
UNSPECIFIED
|
|
Package Shape |
ROUND
|
|
Package Style |
LONG FORM
|
|
Polarity |
UNIDIRECTIONAL
|
BIDIRECTIONAL
|
Power Dissipation-Max |
1.5 W
|
|
Qualification Status |
Not Qualified
|
|
Rep Pk Reverse Voltage-Max |
16.7 V
|
16.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
NO LEAD
|
|
Terminal Position |
END
|
|
Base Number Matches |
5
|
1
|
|
|
|
Compare 1N6114AUS with alternatives
Compare 1N6114AUSE3 with alternatives