1N6024C vs 1N6024BTR feature comparison

1N6024C Microchip Technology Inc

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1N6024BTR Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS, DO-35, 2 PIN HERMETIC SEALED, GLASS, DO-35, 2 PIN
Reach Compliance Code compliant unknown
Factory Lead Time 14 Weeks
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 500 Ω
JEDEC-95 Code DO-204AH DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.48 W 0.48 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 100 V 100 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 2% 5%
Working Test Current 1 mA 1 mA
Base Number Matches 1 2
Pbfree Code No
Part Package Code DO-35
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
Operating Temperature-Min -65 °C

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