1N6008CUR-1
vs
MXMLL6008CURE3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DO-213AA
DO-213AA
Package Description
HERMETIC SEALED, GLASS, SOD-80, MELF-2
HERMETIC SEALED, GLASS, MLL34, MELF-2
Pin Count
2
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
e3
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
22 V
22 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
2%
2%
Working Test Current
5 mA
5 mA
Base Number Matches
1
1
Additional Feature
METALLURGICALLY BONDED
Compare 1N6008CUR-1 with alternatives
Compare MXMLL6008CURE3 with alternatives