1N5955BBK
vs
MSP1N5955BGTR
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
CENTRAL SEMICONDUCTOR CORP
MICROSEMI CORP
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
INDUSTRY STANDARD
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
900 Ω
JEDEC-95 Code
DO-41
DO-204AL
JESD-30 Code
O-PALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
175 °C
Package Body Material
PLASTIC/EPOXY
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
1.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
180 V
180 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
2.1 mA
2.1 mA
Base Number Matches
1
1
Part Package Code
DO-41
Package Description
O-LALF-W2
Pin Count
2
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500
Compare 1N5955BBK with alternatives
Compare MSP1N5955BGTR with alternatives