1N5955BBK vs MSP1N5955BGTR feature comparison

1N5955BBK Central Semiconductor Corp

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MSP1N5955BGTR Microsemi Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer CENTRAL SEMICONDUCTOR CORP MICROSEMI CORP
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature INDUSTRY STANDARD
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 900 Ω
JEDEC-95 Code DO-41 DO-204AL
JESD-30 Code O-PALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Package Body Material PLASTIC/EPOXY GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 180 V 180 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 2.1 mA 2.1 mA
Base Number Matches 1 1
Part Package Code DO-41
Package Description O-LALF-W2
Pin Count 2
Operating Temperature-Min -65 °C
Reference Standard MIL-19500

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