1N5952BP-TP
vs
1N5952BG
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DO-41
|
|
Package Description |
O-PALF-W2
|
HERMETIC SEALED, GLASS, DO-41, 2 PIN
|
Pin Count |
2
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Samacsys Manufacturer |
MCC
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
450 Ω
|
|
JEDEC-95 Code |
DO-41
|
DO-204AL
|
JESD-30 Code |
O-PALF-W2
|
O-LALF-W2
|
JESD-609 Code |
e3
|
e0
|
Knee Impedance-Max |
5000 Ω
|
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
175 °C
|
Operating Temperature-Min |
-55 °C
|
-65 °C
|
Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
260
|
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
1.5 W
|
1.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
130 V
|
130 V
|
Reverse Current-Max |
0.001 µA
|
|
Surface Mount |
NO
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Time@Peak Reflow Temperature-Max (s) |
10
|
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
2.9 mA
|
2.9 mA
|
Base Number Matches |
1
|
3
|
Factory Lead Time |
|
14 Weeks
|
|
|
|
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