1N5951AG vs MSP1N5951AG feature comparison

1N5951AG Microchip Technology Inc

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MSP1N5951AG Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS, DO-41, 2 PIN O-LALF-W2
Reach Compliance Code compliant compliant
Factory Lead Time 14 Weeks
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AL DO-204AL
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 120 V 120 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 10% 10%
Working Test Current 3.1 mA 3.1 mA
Base Number Matches 2 1
Pbfree Code No
ECCN Code EAR99
HTS Code 8541.10.00.50
Reference Standard MIL-19500

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