1N5922UR-1E3 vs MLL5922 feature comparison

1N5922UR-1E3 Microsemi Corporation

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MLL5922 Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description O-LELF-R2 HERMETIC SEALED, GLASS, MELF-2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED, HIGH RELIABILITY METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AB DO-213AB
JESD-30 Code O-LELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.25 W 1.25 W
Reference Voltage-Nom 7.5 V 7.5 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 20% 20%
Working Test Current 50 mA 50 mA
Base Number Matches 1 1
Rohs Code No
Part Package Code DO-213AB
Pin Count 2
Dynamic Impedance-Max 3 Ω
JESD-609 Code e0
Knee Impedance-Max 400 Ω
Moisture Sensitivity Level 1
Qualification Status Not Qualified
Reverse Current-Max 5 µA
Terminal Finish TIN LEAD

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