1N5818-1 vs BYV10-30143 feature comparison

1N5818-1 Microchip Technology Inc

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BYV10-30143 NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC NXP SEMICONDUCTORS
Package Description HERMETIC SEALED, GLASS PACKAGE-2 O-LALF-W2
Reach Compliance Code compliant unknown
Factory Lead Time 24 Weeks
Application GENERAL PURPOSE
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 0.6 V
JEDEC-95 Code DO-41
JESD-30 Code O-LALF-W2 O-LALF-W2
Non-rep Pk Forward Current-Max 25 A
Number of Elements 1 1
Number of Phases 1
Number of Terminals 2 2
Output Current-Max 1 A 1 A
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Reference Standard MIL-STD-750
Rep Pk Reverse Voltage-Max 30 V 30 V
Reverse Current-Max 100 µA
Reverse Test Voltage 30 V
Surface Mount NO NO
Technology SCHOTTKY SCHOTTKY
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8541.10.00.80
Operating Temperature-Max 125 °C
Qualification Status Not Qualified

Compare 1N5818-1 with alternatives

Compare BYV10-30143 with alternatives